1. Overview of Equipment and Application Fields

The high-end programmable servo gel homogenizer AC200-PE is a flagship fully automated spin coating system engineered for advanced semiconductor manufacturing, cutting-edge microelectromechanical systems (MEMS), third-generation photovoltaic cells, and pioneering nanomaterial research. As the pinnacle model in the AC200 series, the "PE" designation signifies its premium positioning in Performance and Precision. Equipped with imported top-tier servo motors and next-generation industrial-grade PLC control systems, this system achieves ultra-precise speed and acceleration control while optimizing fluid dynamics through intelligent algorithms to ensure flawless film uniformity and repeatability across various substrates. Featuring a fully HDPE solvent-resistant interior, explosion-proof PC observation window, and modular expansion design, it supports substrate processing from wafers as small as 1 inch to 8-inch or even 12-inch (optional). Advanced capabilities include dynamic edge removal (EBR), back high-pressure cleaning, multi-channel automatic dispensing switching, and in-situ cleaning and development. Its compact, customizable low-profile design allows seamless integration into glove boxes, meeting the stringent requirements for materials like perovskite and organic semiconductors that are highly sensitive to water and oxygen. The AC200-PE stands as the ultimate choice for laboratories, pilot lines, and high-end R&D centers pursuing extreme process stability and data reproducibility.

2. Core Functional Highlights

· Superior Servo Drive and Atomic-level Uniformity

o Ultra-precision servo control: Featuring imported high-end servo motors with a speed range of 20-12,000 rpm (higher speeds optional), achieving 0.1 rpm adjustment accuracy and maintaining steady-state precision within ±0.5 rpm – significantly surpassing industry standards.

o Ultra-fast acceleration response: The acceleration is continuously linearly adjustable within the range of 20-60,000 rpm/s, instantly reaching the set speed. This significantly reduces the unstable flow period of the adhesive solution and markedly improves film uniformity.

o Excellence in Film Thickness: Rigorous testing demonstrates that applying standard photoresist on 8-inch wafers achieves uniformity within ±0.8% per wafer and ±0.9% between wafers. For substrates ≤4 inches, the uniformity is further optimized to within ±0.3%, meeting the stringent requirements for nanoscale thin film fabrication.

· Intelligent Advanced Program Control and Human-computer Interaction

o Next-generation PLC core: Featuring a high-performance industrial-grade PLC controller with rapid processing speed, exceptional interference resistance, and support for complex logic operations and real-time feedback regulation.

o 10-inch HD full-color touchscreen: Featuring a large, high-resolution color display with a graphical interface, it supports multilingual switching and real-time visualization of RPM curves, acceleration curves, and remaining time, delivering an exceptional user experience.

o Extensive process storage: Supports up to 200 process program groups, each editable with 200 steps, featuring a single-step duration of up to 9999 seconds and a time resolution of 0.01 seconds. Enables formula-based programming and conditional jumps, meeting the demands of highly complex gradient coating or multilayer composite film processes.

· Fully Automated and Advanced Process Module

o Multi-specification vacuum loaders: Featuring a full range of standard suction cups (10mm, 25mm, 2-inch, 4-inch, 6-inch, 8-inch) with quick-change design, and customizable for 12-inch wafers or irregular substrates.

o Advanced Automatic Dispensing System: Featuring 6 standard dispensing ports (expandable to 12), it supports seamless switching, precise dosing, and cleaning of adhesives with varying viscosities and chemical properties, enabling fully automated continuous operation.

o Dynamic Edge Bonding Removal (EBR): Featuring an integrated high-precision robotic arm or nozzle system, this solution dynamically removes excess adhesive from wafer edges during rotation with adjustable width and ±0.1mm precision, effectively resolving lithography alignment challenges.

o Backside cleaning and drying: Optional high-pressure solvent spray and high-speed airflow drying modules are available to automatically clean the wafer backside and edges, preventing cross-contamination.

o In-situ cleaning and developing: Customizable integrated splash-proof hood cleaning and developing functions can complete the entire process of coating, soft baking (requiring external heating module), developing, cleaning, and drying within the same chamber, significantly improving efficiency and reducing particulate contamination.

· Ultimate durability design with safety and environmental protection

o Fully corrosion-resistant inner cavity: The inner cavity, waste liquid collection system, and pipelines are all constructed with premium HDPE or PFA materials, resistant to all strong acids, strong alkalis, and organic solvents, ensuring long-term use without corrosion or leaching.

o Explosion-proof safety observation window: The top cover is made of thickened solvent-resistant PC material, offering high transparency and explosion/splash resistance, with safety latches and cover-opening shutdown protection.

o Forward/reverse and pulse modes: The motor features unique forward/reverse control and pulse rotation mode, ideal for special fluid spreading or auxiliary cleaning.

o The glove box features deep compatibility: The device height can be customized to below 40cm, with all interfaces (power, gas, and drainage) positioned rear or side, perfectly adapting to various glove box specifications. It supports aseptic operations under inert gas protection.

o Waste gas treatment interface: A standard waste gas discharge port is provided for connection to external scrubbers or activated carbon adsorption systems, complying with environmental regulations.

3. Technical Parameters and Specifications

4. Typical Application Scenarios

· Advanced semiconductor lithography: Depositing extreme ultraviolet (EUV), deep ultraviolet (DUV), and i-line photoresists on silicon wafers, SOI, GaAs, and GaN substrates for 7nm and below node process development.

· Third-generation photovoltaic cells: The functional layers for high-efficiency perovskite solar cells, organic photovoltaic (OPV) cells, and quantum dot solar cells require extremely high uniformity in film thickness and absence of pinhole defects.

· Flat-panel display and Micro-LED: The process involves coating OLED light-emitting layers, TFT insulating layers, and Micro-LED bulk transfer temporary bonding adhesive on glass or flexible substrates.

· MEMS and sensors: Coating sacrificial layers, structural layers, and sensitive material films for the fabrication of devices such as accelerometers, gyroscopes, and biosensors.

· Nano-film: Sol-gel method for preparing high dielectric constant oxide, ferroelectric film, superconductor film and nano-composite coating.

· Rigorous environmental preparation: deposition of water-oxygen sensitive organic semiconductors, metal-organic frameworks (MOFs), and novel two-dimensional material films is performed within a glove box.

· Pilot-scale and small-scale production: Featuring high reproducibility and automation capabilities, this system is ideal for process validation and trial production during the transition from laboratory R&D to small-batch manufacturing.

5. Why choose the premium AC200-PE programmable servo glue homogenizer?

The premium programmable servo film homogenizer AC200-PE represents the pinnacle of current spin coating technology. More than just a machine, it serves as your trusted partner for obtaining precise experimental data and stable process outcomes. With ultra-high rotational speed accuracy of ±0.5 rpm and transient response up to 60,000 rpm/s, it ensures atomic-level uniformity in thin films on every wafer. The system's 200-step ×200-group super-programming capability, combined with 12-channel automatic dispensing and dynamic edge removal functions, enables one-click automation of even the most complex processes. Whether tackling 12-inch wafer challenges or exploring sensitive materials in glove boxes, the AC200-PE delivers flagship-level performance, military-grade stability, and intuitive smart operation to help you break through bottlenecks in semiconductor, photovoltaic, and new materials industries, leading innovation. Choosing the AC200-PE means choosing the gold standard for future micro-nano manufacturing.